Reagent / Buffers / Adhesive
Silver Conductive 18DB70X This material was specially formulated for use in geographic areas that demand the use of low VOC (Volatile Organic Compounds) products. It also provides low ohms at very thin dry film thickness on almost any surface, and exhibits excellent long term shielding and grounding properties. |
Formaldehyde,Reagent,A.C.S. (Formalin) EM Grade Paraformaldehyde - methanol free solution. - 10% Aqueous Solution - 16% Aqueous Solution - 20% Aqueous Solution - 32% Aqueous Solution |
Diamond Suspension A versatile, water based suspension designed for most production applications. This special formulation provides:
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Colloidal Alumina As an acidic dispersion, Colloidal Alumina is a chemical-mechanical action, that provides superior surfaces on germanium, silicon, gallium arsenide, zinc sulphide, fluorides, sapphire, ferrite's and silicon carbide. Properties: pH: 3 - 3.5; solids: 20%; viscosity: thixotropic. |
Alumina Slurry These suspensions are water-based and contain no additives, which may interfere with polishing or contaminate the sample. All slurries are very stable and alumina is evenly dispersed. Excellent for the finest finishes. |
Anhydrous EM Grade Glutaraldehyde Specially Prepared-10% Solution. Rapid-Freezing on a polished metal surface, at the temp. of liquid helium or liquid nitrogen. |
EPO-TEK – Epoxy Conductive Adhesive Epo-Tek® EE129-4 is a room temperature cure, silver-filled epoxy, designed for making electrical connection in SEM mounting sample, circuit assembly, semiconductor, LCD applications. Epo-Tek® EE129-4 comes with two parts: A & B and mixing ratio is 1:1. |
Fluoromount-G™Slide MountingMedium A special mounting media for immunofluorescent staining procedures. |